| SMT RoHS Compliance Worksheet | |||||||||||||
| Series or Type | Description or Photo | RoHS Compliance Identification on Device | Termination Finish | PB Free | RoHS Compliant | Compliant Part Number | Package Marking | Date Compliant | Moisture Sensitivity Level (IPC/JEDEC J-STD-020C) | Soldering Conditions (Temp/Time) | Notes | ||
| V-Chips | |||||||||||||
| AEB | (10 mm Dia) Aluminum Electrolytic Capacitors (SMT) | N | Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | CDE Case Code "J" & "K" use a low boiling point electrolyte which will not stand up to Pb-Free soldering processes | |||
| AEB | (12.5 - 18 mm Dia) Aluminum Electrolytic Capacitors (SMT) | N | Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | £ 5 Sec at 230° C (12.5 mm to 18mm Dia) | CDE Case Code: L, P, U, R, S | ||
| AFC | (4 - 10mm Dia) Aluminum Electrolytic Capacitors (SMT) | N | Sn·3Bi/Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | £ 5 Sec at 250° C (4 mm to 6.3mm Dia); £ 5 Sec. At 235° C (8mm to 10 mm Dia) | CDE Case Codes: B, C, D CDE Case Codes: E, F, G | ||
| AFC | (12.5 - 18 mm Dia) Aluminum Electrolytic Capacitors (SMT) | N | Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | £ 5 Sec at 250° C (4 mm to 6.3mm Dia); £ 5 Sec. At 235° C (8mm to 10 mm Dia) | CDE Case Code: L, P, R, S | ||
| AFK | (4 - 10 mm Dia) Aluminum Electrolytic Capacitors (SMT) | N | Sn·3Bi/Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | £ 5 Sec at 250° C (4 mm to 6.3mm Dia); £ 5 Sec. At 235° C (8mm to 10 mm Dia) | CDE Case Codes: B, C, D , X CDE Case Codes: E, F, G | ||
| AFK | (12.5 - 18 mm Dia) Aluminum Electrolytic Capacitors (SMT) | N | Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | £ 20 Sec at 230° C (³ 12.5 mm Dia) | CDE Case Codes: H, P, R | ||
| AHA | Aluminum Electrolytic Capacitors (SMT) | N | Sn·3Bi/Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | £ 5 Sec at 250° C (4 mm to 6.3mm Dia); £ 5 Sec. At 235° C (8mm to 10 mm Dia) | CDE Case Codes: B, C, D , X CDE Case Codes: E, F, G | ||
| AHD | Aluminum Electrolytic Capacitors (SMT) | N/A | N/A | N | N | N/A | N/A | N/A | N/A | £ 5 Sec at 240° C (4 mm to 6.3mm Dia); £ 5 Sec. At 230° C (8mm to 10 mm Dia) | CDE Case Codes: B, C, D CDE Case Codes: E, F, G | ||
| AVS | Aluminum Electrolytic Capacitors (SMT) | N | Sn·3Bi/Sn | Y | Y | Add -F | Per JESD97 | 8/1/2003 | N/A | £ 5 Sec at 250° C (4 mm to 6.3mm Dia); £ 5 Sec. At 235° C (8mm to 10 mm Dia) | CDE Case Codes: A B, C, D , X CDE Case Codes: E, F, G | ||
| SPA | |||||||||||||
| ESR | SMT Specialty Polymer Aluminum Electrolytic Capacitors | N | Sn | Y | Y | NO CHANGE | Per JESD97 | 5/2002 | Temperature 5°C to 30°C without direct sunlight Humidity: Less than 70% RH Maximum Storage term and condition before opening the package: 2 years after manufacturing (JEDEC J-STD-020B MSL: Level 2) Maximum Storage term and condition before opening the package: Less than 14 days* (JEDEC J-STD-020B MSL: Level 3) * Part Numbers: (7 days or less) ESRD4R7M12R, ESRD100M12R, ESRD150M12R, ESRD220M12R, ESRD2R2M16R, ESRD4R7M16R, ESRD6R8M16R, ESRD8R2M16R and ESRL150M12R All products should be used within the storage term after opening the package. “After the storage limit, baking treatment is necessary to be able to use the products” The storage conditions after baking are the same as those after opening the package. | 240 °C max., 5 s; ≥ 200 °C: 30 s max. | Terminal Base Material: Cu Terminal Finish Material: Sn RoHS Compliant: Date Code May 2002 and beyond | ||
| ESRD | SMT Specialty Polymer Aluminum Electrolytic Capacitors | N | Sn | Y | Y | NO CHANGE | Per JESD97 | 5/2002 | Terminal Base Material: Cu Terminal Finish Material: Sn RoHS Compliant: Date Code May 2002 and beyond | ||||
| ESRE | SMT Specialty Polymer Aluminum Electrolytic Capacitors | N | Sn | Y | Y | NO CHANGE | Per JESD97 | 5/2002 | Terminal Base Material: Cu Terminal Finish Material: Sn RoHS Compliant: Date Code May 2002 and beyond | ||||
| ESRH | SMT Specialty Polymer Aluminum Electrolytic Capacitors | N | Sn | Y | Y | NO CHANGE | Per JESD97 | 5/2002 | Terminal Base Material: Cu Terminal Finish Material: Sn RoHS Compliant: Date Code May 2002 and beyond | ||||
| ESRL | SMT Specialty Polymer Aluminum Electrolytic Capacitors | N | Sn | Y | Y | NO CHANGE | Per JESD97 | 5/2002 | Terminal Base Material: Cu Terminal Finish Material: Sn RoHS Compliant: Date Code May 2002 and beyond | ||||
| SPA | SMT Specialty Polymer Aluminum Electrolytic Capacitors | N | Sn | Y | Y | NO CHANGE | Per JESD97 | 5/2002 | Terminal Base Material: Cu Terminal Finish Material: Sn RoHS Compliant: Date Code May 2002 and beyond | ||||
| SMT Film | |||||||||||||
| FCA | SMT Film Chip Capacitors | N | Sn-Ag-Cu | Y | Y | NO CHANGE | Per JESD97 | 11/02 | 5A | Peak Temp: 240° C max 5 sec Recommended Temp: 235° C max 5 sec | Terminal Finish - Sn-Ag-Cu RoHS Compliant Date Code November 2002 and beyond | ||
| FCN | SMT Film Chip Capacitors | N | Sn-Ag-Cu | Y | Y | NO CHANGE | Per JESD97 | 11/02 | N/A | Peak Temp: 240° C max 5 sec Recommended Temp: 235° C max 5 sec | Terminal Finish - Sn-Ag-Cu RoHS Compliant Date Code November 2002 and beyond | ||
| FCP | SMT Film Chip Capacitors | N | Sn-Ag-Cu | Y | Y | NO CHANGE | Per JESD97 | Nov. 2002 | N/A | Peak Temp: 260° C max 5 sec Recommended Temp: 240° C max 5 sec | Terminal Finish - Sn-Ag-Cu RoHS Compliant Date Code November 2002 and beyond | ||
| MIN (MIN02-002 style) | Teflon® SMT Metal Clad | N/A | Ag | Y | Y | add suffix -F | PER JESD97 | Always | N/A | 260°C/10s | |||
| SMT MICA | |||||||||||||
| MIN (MIN02-002 style) | Mica SMT Metal Clad | N/A | Ag | Y* | Y | add suffix -F | PER JESD97 | 1/1/2006 | N/A | 260°C/10s | |||
| MCM (MCM01-009 style) | Mica SMT Metal Clad | N/A | Ag | Y* | Y | add suffix -F | PER JESD98 | 1/2/2006 | N/A | 260°C/10s | |||
| MC | SMT Mica Chip | N | Sn | Y* | Y | add suffix -F | PER JESD97 | 3/25/2005 | 2A | 220-260/10s | |||
| MCH, MCN | Nonmagnetic SMT Mica Chip | N | Sn | Y* | Y | always been compliant | PER JESD97 | 3/25/2005 | 2A | 220-260/10s | |||
| Revision Date: 04-25-07 | |||||||||||||
| * subject to exemption #5 | |||||||||||||
| To the best of our knowledge, the information provided on the enclosed is correct as of the date indicated on the document. Since some of the information is provided by the acceptance of data from sources outside of Cornell Dubilier Electronics, we can not guarantee that all is complete and accurate. | |||||||||||||
| Temperature 5°C to 30°C without direct sunlight Humidity: Less than 70% RH Maximum Storage term and condition before opening the package: 2 years after manufacturing (JEDEC J-STD-020B MSL: Level 2) Maximum Storage term and condition before opening the package: Less than 14 days* (JEDEC J-STD-020B MSL: Level 3) * Part Numbers: (7 days or less) ESRD4R7M12R, ESRD100M12R, ESRD150M12R, ESRD220M12R, ESRD2R2M16R, ESRD4R7M16R, ESRD6R8M16R, ESRD8R2M16R and ESRL150M12R All products should be used within the storage term after opening the package. “After the storage limit, baking treatment is necessary to be able to use the products” The storage conditions after baking are the same as those after opening the package | |||||||||||||
| Humidity: Less than 70% RH | |||||||||||||
| Maximum Storage term and condition before opening the package: | |||||||||||||
| 2 years after manufacturing | |||||||||||||
| (JEDEC J-STD-020B MSL: Level 2) | |||||||||||||
| Maximum Storage term and condition before opening the package: | |||||||||||||
| Less than 14 days* | |||||||||||||
| (JEDEC J-STD-020B MSL: Level 3) | |||||||||||||
| * Part Numbers: (7 days or less) ESRD4R7M12R, ESRD100M12R, ESRD150M12R, ESRD220M12R, ESRD2R2M16R, ESRD4R7M16R, ESRD6R8M16R, | |||||||||||||
| ESRD8R2M16R and ESRL150M12R | |||||||||||||
| All products should be used within the storage term after opening the package. | |||||||||||||
| “After the storage limit, baking treatment is necessary to be able to use the products” | |||||||||||||
| The storage conditions after baking are the same as those after opening the package. | |||||||||||||